We recently spotted a sketchy looking image of the 2016 #MotoX out in the wild. While it was hard to judge the authenticity of this leak, there was no denying that we were a little excited at the prospects of the 2016 Motorola flagship. Today, an insider has managed to capture a never before seen image of the 2016 Moto X, which shows a heat pipe passing right under the battery slot.
This tells us that the company is not taking any risks as far as the chipset is concerned. This is probably because the device is expected to be using the Snapdragon 820 SoC, which is yet to officially reach manufacturers.
It’s not known as to whether the Snapdragon 820 has any overheating related trouble, but it’s good to see that Motorola is prepared for any eventuality. With overheating being one of the primary concerns for Qualcomm this year, it’s understandable that the manufacturers are taking such steps.
As for the device itself, we can’t learn much here, but it appears to be a new handset that we haven’t seen before, so there’s no reason why this can’t be the 2016 Moto X. That being said, we suggest you take this report with a pinch of salt. What do you make of this leak? Sound off in the comments section below.