HTC’s big new flagship, the M8, hasn’t been announced yet—the event is scheduled for March 25 – but that hasn’t stopped the device from being unveiled early on the Internet. Not only is a Verizon dummy unit giving us a comprehensive look at the device’s design, but leaked packaging with full specs has hit the Web, basically revealing all the juicy details. Everything from the processor, to camera, to RAM, all revealed.
The dummy unit doesn’t necessarily provide any new information, though it gives us a nice look at the device from every angle. That brushed aluminum design is looking nice, and the more rounded design makes us think the handset will feel good in the hand (as expected). You can see that in addition to the dual-camera arrangement, there’s also dual-LED, while the nanoSIM tray is just above the volume rocker on the device’s right side; meanwhile, the headphone jack is on the bottom, next to the microUSB, while the BoomSound speakers are still front-facing.
The alleged packaging provides the best look, however: 2.3GHz Snapdragon 801 processor, 2GB of RAM, 32GB of storage (microSD expandable to 128GB), 5-inch 1080p display, Duo Camera with UltraPixel, f2.0/28mm lens, HTC ImageChip 2 with HDR video, front-facing 5-megapixel shooter, HTC Zoe, Bluetooth 4.0 and more. So it sounds like the sensor will still be the same as the previous HTC One, though the second lens will give users some new capabilities.
HTC essentially has nothing hardware related to announce when March 25 comes around, though we still don’t actually know how Sense 6 will be improved, for example. The camera will obviously be a huge focus (pun!), though we pretty much know exactly what to expect. Can HTC surprise us with anything when the M8 is finally announced? Given all the leaks we’ve seen this week alone, it doesn’t really seem like HTC has any more tricks left up its sleeve. We’ll find out in another few weeks (but probably sooner).