Contrary to what most people may think, the super slim Ascend P6 wasn’t Huawei’s flagship Android smartphone for last year – the Ascend D2 was. The Ascend D series (where D stands for ‘diamond’) has always been the Chinese company’s highest performing line, and the D2 had better specs than the P6. But the latter was a lot better looking, so it probably managed to achieve larger sales numbers compared to the Ascend D2.
Huawei unveiled the Ascend D2 at last year’s CES, but hasn’t outed its successor thus far even though CES 2014 came and went. Yesterday we told you that the company plans on unveiling a brand new smartphone during MWC in Barcelona at the end of this month, and that may very well be the elusive Ascend D3 (since the Ascend P7 will apparently get its own event later on).
If you’re wondering what to expect from the D3 in terms of specs, well it will purportedly come with a HiSilicon Kirin 920 chipset. This will feature an octa-core CPU clocked at 1.8 GHz. It won’t be a ‘true’ octa-core unit like MediaTek’s MT6592, though, where all the cores can work at once. Rather, it will use two clusters of four cores, only one of which can be active at a time – much like Samsung’s first octa-core efforts.
One cluster will get higher-performance cores, based on ARM’s Cortex-A9 design, and the other cluster will focus on battery life with four ARM Cortex-A7 cores. This is all based on ARM’s big.LITTLE architecture, and the processor will be manufactured using a 28nm process.
HiSilicon is basically Huawei’s chipset making arm, and the company has used such processors in all of its high-end devices for a couple of years now.
The Ascend D3 could be just 6.3 mm thin, and may have a 16 MP rear camera. Its screen will probably be around 5 inches in size, with 1080p Full HD resolution.