They say that when you repeat a lie often enough, it could jolly well end up as the perceived truth. Well, while a rumor is not a lie per se, this does not mean that repeating a rumor many times over would not end up being taken as the gospel truth by some. It seems that there has been whispers of Apple making use of an Intel modem chip underneath the hood of the upcoming iPhone 7 from Apple, and we have heard of that before. Well, another report today claims that Intel will be responsible for half of those chips.
What happens then, to the remaining 50% of the chips? Well, chances are pretty good that it will be sourced from Apple’s existing supplier of modem chips, which would be none other than Qualcomm. This rumor picked up additional steam in April when Qualcomm CEO Steve Mollenkopf did mention that Qualcomm would be losing one of its modem clients, although did not name which – and no doubt that Apple as the name that was at the back of most peoples’ minds.
This latest rumor claims that Intel will package its modem chips, leaving the manufacturing bit to TSMC and King Yuan Electronics. Ah well, we will simply have to wait and see.