Apple’s iPhone 7 is expected to be launched later this year. Presumably it will sport a brand new design, and if Apple keeps doing what they are doing, chances are it could be slimmer/lighter than its predecessor. However if you were worried that a slimmer phone means skimping out on the battery, it seems that you needn’t be worried.
At the same time, Apple is also expected to employ a “fan-out” chip packaging method. What this means is that it will result in a more compact motherboard and antenna area, which in turn leaves more room for other components like extra battery, for example. Apple is also reportedly placing orders to its suppliers in Japan and other markets.
As additional “proof”, TSMC had also previously mentioned they were producing 16nm wafers with a “fan-out” design for one sole customer, and if the rumors are to be believed, TSMC is said to be the main (or possibly sole) manufacturer of Apple’s A10 chipset. Take it with a grain of salt for now but if Apple can pull it off, why not?