LIBERTYVILLE, USA – It has only been a week or so since Moto X, the flagship device from Motorola, is out and here we see a teardown of the phone by people at iFixit.
A leak suggests that Moto X with wooden back covers might cost extra, perhaps US$50. Ron Amadeo from Ars Technica posted on his Google+ this information detailing wooden variants such as bamboo, teak and others, which had “price:50″ added to their HTML tags.
The noteworthy chips discovered by iFixit’s teardown include quite a number of ICs that the readers may find interesting. The phone features eMMC NAND 16 GB Flash from Toshiba, a Texas Instruments TMS320C55 and NXP 44701.
A few ICs come from Qualcomm, namely the power management PM8921, WCD9310 Audio Codec and WCN3680 Combo Wi-Fi/Bluetooth/FM.
Other circuits include Skyworks 77737 SkyHi Power Module for LTE Bands and Skyworks 77619-12 Multiband Multimode Power Amplifier Module.
Finally, iFixit concludes that Moto X managed to score a 7 out of 10 on the scale of repairability.